ISPEC to Drive India’s Semiconductor, Packaging and Systems Research Ambitions for sustainable Design led Manufacturing

ISPEC to Drive India’s Semiconductor, Packaging and Systems Research Ambitions for sustainable Design led Manufacturing

Mohali, 01 March, 2024: The India Semiconductor and Packaging Ecosystem Conference (ISPEC) was inaugurated today (29th Feb) by Hon’ble Sh. Rajeev Chandrasekhar, Minister of State for Electronics and IT and Skill Development and Entrepreneurship and will continue till March 2nd, 2024, at Mohali, India, supported by ISM, SCL, IESA, IEEE Packaging Society, and ISSE.

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As India embarks on a transformative journey into semiconductor and package manufacturing, backed by a $10 billion incentive from the Indian Semiconductor Mission (ISM), there is a critical need to cultivate a comprehensive and sustainable ecosystem encompassing design, research and development (R&D), manufacturing, product development, applications, services, and workforce development. ISPEC aims to address this need by fostering large scale global-level R&D and workforce development, in collaboration with international industry and academic leaders, to establish a robust Industry-Academic consortium for the next generation of semiconductors, packaging, and systems in India.

Speaking as Chief Guest at the inaugural event, Sh. Rajeev Chandrasekhar, Minister of State for Electronics and IT and Skilling, said, “The Progress Since the Past Two Years in the Indian Semiconductor Industry is Just the Tip of the Iceberg. What is Yet to Come is Yet to Unfold in the Third Term of PM Modi ji. We Have Moved From Being Almost Absent in the Semiconductor Ecosystem to Now Becoming a Destination Receiving Investments. India is reaching a milestone where over two and a half lakh crore or $26 billion of investment proposals have been received by the Government of India in a spectrum of opportunities ranging from packaging, design, R&D, and Manufacturing. Therefore, I think we can safely say that we are at an inflection point.”

Speaking at the occasion, Mr. Akash Tripathi, CEO India Semiconductor Mission stated, “Moving from vision to reality for semiconductor manufacturing in India, several proposals are being actively pursued and are getting government support up to 70%, including Central and state government. The efficiency of approvals and follow-up actions are attracting strong interest from the Industries.”

Prof Rao Tummala, Advisor to ISM, a key driving force behind the large scale global R&D event, said, “The 1st India Semiconductor and Packaging Ecosystem Conference (ISPEC) is a testament to India’s commitment to nurturing and excellence in all four phases of product development—design, Research, technology development and manufacturing. And , setting up path for the industry-academic research R&D collaboration in system design , semiconductor, packaging and systems.

The Inaugural session Chaired by Mr. Ashok Chandak, President IESA had the top 9 Industry leaders (IESA Member companies) setting the vision statements, lessons learned, and defining the future of Semiconductor Industry development from India. Mr. Ashok Chandak, President of IESA, stated, “As we unite the brightest minds from academia and industry, we are setting the stage for breakthroughs that will accelerate the IPR and product creations from India. IESA is at the forefront of this endeavor, catalyzing partnerships and knowledge-sharing that will make India a semiconductor powerhouse.” Today is also a historical milestone of Cabinet approval of three Semiconductor plant proposals worth 1.26 Lakh crores. ISPEC supporting association IESA feels proud of their members TATA Electronics and Renesas making mega moves and commitment to semiconductor manufacturing in India.

ISPEC unites global R&D, supply-chain, manufacturing, and user companies from India, United States, Europe, Japan, Korea, and Taiwan. The conference has a presence of 415 delegates, 240 industry participants from Industries, 25 global delegates, 50+ Faculties from TOP Technical institutes, 55+ speakers, 60 students. Members SCL, IESA, IEEE Packaging Society, and ISSE have been instrumental in the planning and implementation of one of the most successful events with SCL from Chandigarh staff doing major heavy lifting.

Rabindra

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